The strategy could improve product differentiation and bolster Xiaomi's negotiating position with outside chip suppliers, all the while supporting its expansion into premium smartphones.
Xiaomi launched its first proprietary smartphone processor, the Xring O1, in 2025.
One source said the chip is expected to power Xiaomi's next flagship foldable phone, with shipments targeted at between 200,000 and 300,000 units.
Foldables offer Xiaomi an opportunity to compete more directly in a premium category currently dominated in China by Huawei.
Together, these projects show that Xiaomi is extending its chip-development strategy beyond smartphones into AI-enabled consumer devices and autonomous driving.
Xiaomi Corporation (OTC:XIACF) is no longer content to compete through hardware design and pricing alone. The Chinese smartphone maker has unveiled the Xring O3, which is the second generation of its proprietary handset processor, as it seeks greater control over the technology powering its devices.
The strategy could improve product differentiation and bolster Xiaomi's negotiating position with outside chip suppliers, all the while supporting its expansion into premium smartphones. However, the investment comes as rising component costs and weakening global handset demand are already pressuring the company's core business. Let's dive deeper into it.
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Developing processors internally could give Xiaomi greater control over several features that influence the smartphone experience. A system-on-chip integrates computing, graphics, artificial intelligence processing, and imaging functions, allowing the company to optimize important capabilities around its own hardware and software. Xiaomi launched its first proprietary smartphone processor, the Xring O1, in 2025. During its latest earnings call, the company said cumulative shipments of O1-powered smartphones, tablets, and watches had surpassed one million units. Although Reuters' sources estimated that only approximately 150,000 of those shipments were smartphones, the broader total shows Xiaomi has already deployed the technology across multiple product categories.
The O3 could also support Xiaomi's push into more expensive devices. According to two people familiar with the plans, TSMC will manufacture the processor using its 3-nanometre technology. One source said the chip is expected to power Xiaomi's next flagship foldable phone, with shipments targeted at between 200,000 and 300,000 units. Foldables offer Xiaomi an opportunity to compete more directly in a premium category currently dominated in China by Huawei. Huawei shipped 1.6 million foldable smartphones in China during the second quarter, accounting for 68% of the market, according to data cited by Reuters.
The company's ambitions also extend beyond smartphones. Reuters reported that Xiaomi contracted TSMC to produce the Xring O100, a 6-nanometre neural-processing chip designed to support its MiMo artificial-intelligence model on consumer devices, and the Xring D100, a 3-nanometre autonomous-driving processor. Xiaomi said both chips have completed development and are scheduled for deployment next year. Together, these projects show that Xiaomi is extending its chip-development strategy beyond smartphones into AI-enabled consumer devices and autonomous driving.
